ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,324, issued on Jan. 20, was assigned to QUALCOMM Inc. (San Diego). "Techniques for dynamic transmission parameter adaptation" was invented ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,851, issued on Jan. 20, was assigned to Volvo Truck Corp. (Gothenburg, Sweden). "Offline authentication and authorization for networked dev... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. D1,109,537, issued on Jan. 20. "Knife cleaning brush" was invented by Ming Wang (Chizhou, China). The patent was filed on July 4, 2024, under App... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. D1,109,529, issued on Jan. 20, was assigned to Beijing Xiaomi Mobile Software Co. Ltd. (Beijing). "Earphone box" was invented by Yuhao Zhang (Beij... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,988, issued on Jan. 20, was assigned to KYOCERA Document Solutions Inc. (Osaka, Japan). "Image forming apparatus" was invented by Hiroto Ko... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,460, issued on Jan. 20, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Automated governance policy-based security fo... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,859, issued on Jan. 20, was assigned to CommScope Technologies LLC (Claremont, N.C.). "Anisotropic cable sealing gels; and methods for fabr... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,313, issued on Jan. 20, was assigned to Orica International Pte Ltd. (Singapore). "Fragmentation georeferencing" was invented by Benny Chen... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,562, issued on Jan. 20, was assigned to Alibaba (China) Co. Ltd. (Hangzhou, China). "Chiplet-based hierarchical tree topology architecture ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,111, issued on Jan. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package including memory die s... Read More